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| TELEFUNKEN Semiconductors U2797B 1000-MHz Quadrature Modulator Description The IC U2797B is a 1000-MHz quadrature modulator that uses TELEFUNKEN's advanced UHF process. It features a frequency range from 100 MHz up to 1000 MHz, low current consumption, and single-ended RF and LO ports. The I/Q input impedance is about 150 kW. Adjustment free application makes the direct converter suitable for all digital radio systems up to 1000 MHz, e.g., GSM, DAMPS, PDC. Features D Supply voltage: 5 V (typical) D Low power consumption: 30 mA / 5 V (typical at -1 dBm output level) D 50-W single-ended LO and RF port D LO- frequency range of 100 MHz to 1 GHz D SSO 20 package D 150 kW I/Q input impedance D Excellent sideband suppression by means of duty cycle regeneration of the LO input signal Benefits D Extended talk time due to increased battery life D Few external components result in cost and board space saving D Phase control loop for precise 90 phase shifting D Power down mode D Low LO input level: -10 dBm (typical) D Adjustment-free hence saves time Block Diagram SPD BBAi BBAi 10 9 8 PD 1 5,6 VS Power 7 down V 13 Ref 14 Duty cycle regenerator 19 Phase adj. 20 LO i BBBi BBBi 11 12 94 8185 e Frequency doubler 0 90 90 control loop M 4 RFo 2, 3, 15, 16, 17, 18 GND Ordeing Information Extended Type Number U2797B-AFS U2797B-AFSG3 Package SSO20 SSO20 Remarks Rail, MOQ 830 pcs. Tape & reel, MOQ 4000 pcs. Rev. A1: 06.09.1995 1 (13) U2797B Pin Description SSO 20 PD GND GND RFO VS VS VS SPD BBAi BBAi 1 2 3 4 5 6 7 8 9 10 94 8186 e TELEFUNKEN Semiconductors U2790B-FS (SSO 20) 20 19 18 17 16 15 14 13 12 11 Phadj Phadj GND GND GND GND LOi VREF BBBi BBBi Pin Symbol Function 1 PD Power down port 2 GND Ground 3 GND Ground 4 RFo RF output 5 VS Supply voltage 6 VS Supply voltage 7 VS Supply voltage 8 SPD Settling time power down 9 BBAi Baseband input A 10 BBAi Baseband input A inverse 11 BBBi Baseband input B 12 BBBi Baseband input B inverse 13 VREF Reference voltage (2.5 V) 14 LOi LO input 15 GND Ground 16 GND Ground 17 GND Ground 18 GND Ground 19/20 Phadj Phase adjustment (not necessary for regular applications) Absolute Maximum Ratings Parameters Supply voltage Pins 5, 6 and 7 Input voltage Pins 9, 10, 11, 12, 14 and 15 Junction temperature Storage temperature range Symbol VS Vi Tj Tstg Value 6 0 to VS 125 - 40 to + 125 Unit V V C C Operating Range Parameters Supply voltage range Pins 5, 6 and 7 Ambient temperature range Symbol VS Tamb Value 4.5 to 5.5 - 40 to + 85 Unit V C Thermal Resistance Junction ambient Parameters SSO 20 Symbol Rthja Value 140 Unit K/W 2 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B Electrical characteristics Test conditions (unless otherwise specified): VS = 5 V, Tamb = 25C, referred to test circuit. System impedance ZO = 50 W, fLO = 900 MHz, PLO = -10 dBm, VBBi = 1 Vpp diff Parameters Supply voltage range Supply current Baseband inputs Input voltage range (differential) Input impedance (single ended) Input frequency range LO input Frequency range Input level 1 Input impedance Voltage standing wave ratio Duty cycle range RF output Output level LO suppression 2 Sideband suppression 2,3 Phase error 4 Amplitude error Noise floor VSWR 3rd order baseband harmonic suppression RF harmonic suppression Power down mode Supply current Settling time Test conditions / Pin Pins 5, 6 and 7 Pins 5, 6 and 7 Pins 9-10, 11-12 Symbol VS IS VBBi ZBBi fBBi Pin 14 fLOi PLOi ZiLO VSWRLO DCRLO Pin 4 fLO = 900 MHz fLO = 150 MHz fLO = 900 MHz fLO = 150 MHz PRFo LORFo SBSRFo Pe Ae NFL VSWRRF SBBH SRFH VPD 0.5 V VPD = 1 V CSPD = 100 pF CLO = 100 pF CRFo = 1 nF Pin 1 -5 30 32 35 30 -1 35 35 40 35 <1 <"0.25 - 132 - 144 1.6 45 35 1 10 10 dBm dB dB deg. dB dBm/Hz 2 dB dB 100 - 12 - 10 50 1.4 1000 -5 2 0.6 MHz dBm 0 Min. 4.5 Typ. 30 1000 150 200 1500 Max. 5.5 Unit V mA mVpp kW MHz W - - 0.4 VBBi = 2 V, VBBi = 3 V VBBi = VBBi = 2.5 V 35 x Pins 4, 5 IPD tsPD mA ms V V Pin 6 to 3 VPDon VPDdown 4 1 2.35 2.5 30 2.65 Switching voltage Power on Power down Reference voltage Voltage range Output impedance Pin 13 VRef Zo Ref W V Note: 1 The required LO level is a function of the LO frequency Note: 2 In reference to a RF output level - 1 dBm and I/Q input level of 400 mVpp diff. Note: 3 Sideband suppression is tested without connection at pins 19 and 20. For higher requirements a potentiometer can be connected at these pins. Note: 4 For Tamb = -40 to + 85C and VS = 4.5 to 5.5 V Rev. A1: 06.09.1995 3 (13) v U2797B TELEFUNKEN Semiconductors Typical single sideband output spectrum fLO = 900 MHz, PLO = - 10 dBm, VBBi = 1 VPP (differential), Tamb = 25C 94 7856 e Typical GMSK output spectrum 94 7855 e 4 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B Typical RF-harmonic output spectrum 94 7854 e 16 VBBi = 0.2 VPP IP3 ( dBm ) 12 10 VBBi = 0.4 VPP 8 6 VBBi = 1.0 VPP 4 12 IP3 ( dBm ) 8 VBBi = 0.4 VPP 4 2 0 -40 -20 94 8884 0 20 40 60 80 100 94 8885 0 -40 -20 0 20 40 60 80 100 Temperature ( C ) Temperature ( C ) OIP3 vs. Tamb, LO = 150 MHz, level - 20 dBm OIP3 vs. Tamb, LO = 900 MHz, level - 10 dBm Rev. A1: 06.09.1995 5 (13) U2797B 0.5 0 Output power ( dBm ) -0,5 -1 -1.5 -2 -2.5 -40 -20 94 8887 TELEFUNKEN Semiconductors 40 FLO = 150 MHz Supply current ( mA ) 100 94 8886 30 20 FLO = 900 MHz 10 0 20 40 60 80 0 -40 -20 0 20 40 60 80 100 Temperature ( C ) Temperature ( C ) Output power vs. Tamb Supply current vs. Tamb Typical S11 frequency response of the RF output 94 7850 e 6 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B Typical VSWR frequency response of the RF output 94 7849 e Typical S11 frequency response of the LO input 94 7852 e Rev. A1: 06.09.1995 7 (13) U2797B 11 VBBi ( differential ) ( V ) PP 2 9 7 TELEFUNKEN Semiconductors VSWR 1 5 3 1 100 94 7851 0 1000 LO frequency (MHz) 94 7858 0 200 400 600 800 1000 1200 1400 LO frequency ( MHz ) Typical VSWR frequency Response of the LO Input 60 Typical Required VBBi Input Signal (differential) vs. LO Frequency for PO = 0 dBm and PO = - 2 dBm 0 Supply current ( mA ) 50 -10 40 LO power ( dBm ) -20 0 20 40 60 80 100 -20 30 20 -30 -40 10 -40 94 7845 -50 0 94 7857 Temperature ( C ) 200 400 600 800 1000 1200 1400 LO frequency ( MHz ) Typical supply current vs. temperature at VS = 5 V 0 Typical useful LO power range vs. LO frequency at Tamb = 25C Output power ( dBm ) -5 0 94 7859 200 400 600 800 1000 1200 1400 LO frequency ( MHz ) Typical output power vs. LO-frequency at Tamb = 25C, VBBi = 230 mVPP (differential) 8 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B Application circuit Bias network for ac coupled baseband inputs (VBA, VBB). R1 = 2.5 kW, R2 10 kW for 35 dB LO suppression which is in reference to < 2 mV input offset. R1 R2 10 BBAi BBAi LOi 14 19 Phase adj. 20 BB Bi BBBi 11 12 94 8184 e x v V Ref 13 9 1 Power down PD 5,6 V S 7 S PD 8 Duty cycle regenerator Frequency doubler M 0 90 90 control loop 4 RFo 2, 3, 15, 16, 17, 18 GND PCB layout U2797B-FS (SSO 20) 94 8230 e Rev. A1: 06.09.1995 9 (13) U2797B Evaluation circuit (PCB equip) TELEFUNKEN Semiconductors 94 8229 e Part list C1, C3, C6 C8 C5 P L1, L2 1 nF 100 pF 100 nF Poti 10 kW PCB Inductor 50 W Microstrip optional The above listed components result in a PD settling time of < 20 ms. Use of other component values will require consideration of time requirements in burst-mode applications. 10 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B the mask requirements can be achieved very easily without CPD. A significant improvement of the wide-off noise floor is obtainable with CPD greater than 100 nF. Such values are recommended for applications where the settling time is not critical, such as in base stations. Coupling capacitors for LOi and RFO also have a certain impact on the settling time. The values used for the measurements are CLOi = 100 pF and CRFo = 1 nF. Application notes 1. Noise floor and settling time In order to reduce noise on the power down control input and improve the wide-off noise floor of the 900-MHz RF output signal, capacitor CPD should be connected from pin 8 to ground in the shortest possible way. The settling time has to be considered for the system under design. For GSM applications a value of CPD = 1 mF defines a settling time, tsPD, equal or less than 3 ms. This capacitance does not have any influence on the noise floor within the relevant GSM mask. For mobile application Mixer input stage A, B A, B 94 8187 e Figure 1 baseband input circuitry U2797B-FS ( SSO 20 ) has a 150 kW baseband input impedance. The reference voltage, VREF, is provided at pin 13. Rev. A1: 06.09.1995 11 (13) U2797B Dimensions in mm Package: SSO 20 TELEFUNKEN Semiconductors 95 9943 12 (13) Rev. A1: 06.09.1995 TELEFUNKEN Semiconductors U2797B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 Rev. A1: 06.09.1995 13 (13) |
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